{"id":2206445,"date":"2024-09-11T18:47:44","date_gmt":"2024-09-11T09:47:44","guid":{"rendered":"https:\/\/koreapro.org\/?p=2206445"},"modified":"2024-09-12T15:11:07","modified_gmt":"2024-09-12T06:11:07","slug":"south-korea-bets-205m-on-semiconductor-packaging-to-maintain-competitiveness","status":"publish","type":"post","link":"https:\/\/koreapro.org\/2024\/09\/south-korea-bets-205m-on-semiconductor-packaging-to-maintain-competitiveness\/","title":{"rendered":"South Korea bets $205M on semiconductor packaging to maintain competitiveness"},"content":{"rendered":"

South Korea\u2019s trade ministry <\/span>announced<\/span><\/a> a $205 million (274.4 billion won) investment in the country\u2019s semiconductor packaging industry to keep pace in the rapidly advancing fields of artificial intelligence (AI) and high-performance computing (HPC).<\/span><\/p>\n

However, despite this investment and a newly signed memorandum of understanding (MOU) between key industry players, the country\u2019s historical focus on vertical integration and weak horizontal collaboration raises concerns about whether it can remain competitive in advanced packaging technologies.<\/span><\/p>\n

LACK OF HORIZONTAL INTEGRATION<\/b><\/p>\n

South Korea\u2019s success in memory chip manufacturing has been largely built on <\/span>vertical integration<\/span><\/a>, where companies like Samsung Electronics and SK Hynix control everything from chip design to final assembly.<\/span><\/p>\n

However, advanced packaging technologies, which provide the protective casing for semiconductors and are essential for AI and HPC, demand a more collaborative approach. The <\/span>horizontal integration<\/span><\/a> required for these technologies \u2014 where semiconductor manufacturers, materials suppliers and equipment producers work together \u2014 remains less common in South Korea.\u00a0<\/span><\/p>\n

Many South Korean packaging firms are heavily dependent on a few large contractors, with <\/span>70 to 90%<\/span><\/a> of their revenue tied to companies like Samsung and SK Hynix. This reliance limits broader innovation within the industry, leaving smaller firms with limited capacity to invest in research and development (R&D) independently.<\/span><\/p>\n

In contrast, Taiwan Semiconductor Manufacturing Company (TSMC), a global leader in advanced packaging, benefits from a more diverse network of <\/span>clients and suppliers<\/span><\/a>. This collaborative approach has enabled TSMC to lead the industry with <\/span>custom packaging solutions<\/span><\/a>.<\/span><\/p>\n

This lack of horizontal integration is critical because advanced packaging requires a robust ecosystem of materials suppliers, equipment manufacturers and semiconductor designers. Technologies like <\/span>chiplet packaging<\/span><\/a> and <\/span>3D stacking<\/span><\/a> are central to the future of AI and HPC chips, as they help improve power distribution and data processing.<\/span><\/p>\n

South Korea\u2019s weak collaboration across these sectors could prevent domestic firms from fully capturing the growing market for advanced packaging.<\/span><\/p>\n

RELIANCE ON FOREIGN SUPPLIERS<\/b><\/p>\n

Another risk is South Korea\u2019s heavy reliance on foreign suppliers for the materials and equipment required for advanced packaging.\u00a0<\/span><\/p>\n

According to a <\/span>2023 ROK trade ministry report<\/span><\/a>, over 95% of the materials and equipment necessary for packaging are imported from countries like the U.S., Japan and Taiwan, making South Korea vulnerable to supply chain disruptions.<\/span><\/p>\n

For example, in 2019, when Japan <\/span>restricted exports of critical chemicals<\/span><\/a> used in semiconductor production, South Korean manufacturers faced immediate delays in production. Similar supply chain risks remain, particularly given escalating tensions between the U.S. and China.<\/span><\/p>\n

South Korean firms may find it harder to secure the materials they need to develop and scale their advanced packaging technologies if tensions continue to increase.\u00a0<\/span><\/p>\n

Without consistent access to necessary materials, businesses may face operational risks, such as production delays and rising costs, resulting in a weakened competitive position in the global packaging market.<\/span><\/p>\n

\"\"

An industrial excavator loads material into a heavy-duty dump truck | Image: Canva<\/em><\/p><\/div>\n

INFRASTRUCTURE AND LABOR CONSTRAINTS<\/b><\/p>\n

In addition to external supply chain issues, South Korea faces domestic challenges in scaling its infrastructure.<\/span><\/p>\n

The country\u2019s leading semiconductor manufacturing facilities are concentrated in Gyeonggi Province, near Seoul. Major facilities like <\/span>Samsung\u2019s Pyeongtaek plant<\/span><\/a> and <\/span>SK Hynix\u2019s Icheon plant<\/span><\/a> face restrictions on expansion due to <\/span>land compensation requirements, environmental impact assessments<\/span><\/a> and limited space.<\/span><\/p>\n

Expanding the cleanroom facilities necessary for advanced packaging technologies is also difficult due to strict land-use regulations and <\/span>ongoing labor shortages<\/span><\/a> in high-tech areas like Hwaseong and Yongin \u2014 both located in Gyeonggi.<\/span><\/p>\n

Moreover, smaller companies, particularly those based in Chungcheong Province, lack the financial and logistical resources to overcome spatial limitations or hire the skilled workers needed to handle advanced packaging processes.<\/span><\/p>\n

In contrast, TSMC <\/span>acquired<\/span><\/a> a factory close to <\/span>Southern Taiwan Science Park<\/span><\/a> in August, where it plans to expand its packaging operations. This proximity to a major tech hub allows TSMC to benefit from a ready supply of skilled workers and better access to production infrastructure \u2014 advantages that South Korean firms may struggle to replicate.<\/span><\/p>\n

OPPORTUNITIES IN AI AND HPC MARKETS<\/b><\/p>\n

Despite the risks, South Korea\u2019s push into advanced packaging offers significant opportunities, especially in the rapidly growing AI and HPC markets.<\/span><\/p>\n

As traditional chip miniaturization approaches its physical limits at <\/span>3 nanometers<\/span><\/a>, the industry is increasingly turning to <\/span>2.5D and 3D packaging<\/span><\/a> to boost performance and power efficiency.\u00a0<\/span><\/p>\n

These technologies are essential for the next generation of AI chips and HPC systems, which require large volumes of data to be processed quickly and efficiently.<\/span><\/p>\n

This shift presents a clear opportunity for companies like Samsung and SK Hynix to diversify beyond memory chips and into higher-margin advanced packaging markets. By developing customized packaging solutions for firms like Nvidia and Apple, South Korean companies could secure a foothold in the global AI and HPC markets.<\/span><\/p>\n

Smaller packaging companies also stand to benefit from this shift. As demand for chiplet packaging and 3D stacking increases, firms that can adapt to these technologies will likely see significant growth.<\/span><\/p>\n

\"\"

South Korean President Yoon Suk-yeol presides over a cabinet meeting to discuss the 2025 national budget, Aug. 27, 2024 | Image: ROK Presidential Office<\/a><\/em><\/p><\/div>\n

GOVERNMENT R&D SUPPORT<\/b><\/p>\n

The South Korean government\u2019s decision to commit 274.4 billion won to R&D aims to close the technology gap between South Korea and its global competitors, including TSMC and Intel.<\/span><\/p>\n

The funding will prioritize the development of <\/span>system-in-package and fan-out wafer-level packaging technologies<\/span><\/a>, both of which are critical for AI and HPC applications.<\/span><\/p>\n

This government funding represents a major opportunity for smaller firms that may lack the resources to independently invest in R&D. By partnering with the government, these companies can access the expertise and funds necessary to develop new packaging solutions.<\/span><\/p>\n

The government\u2019s focus on fostering public-private partnerships will also encourage collaboration between manufacturers, packaging firms and materials suppliers.<\/span><\/p>\n

However, it is worth noting that the South Korean government\u2019s decision to <\/span>allocate<\/span><\/a> $22.2 billion (29.7 trillion won) \u2014 an 11.8% increase from this year \u2014 for next year\u2019s R&D budget comes after it <\/span>slashed R&D spending<\/span><\/a> in Dec. 2023 by 15%.\u00a0<\/span><\/p>\n

As a result, South Korean businesses may still find themselves fighting an uphill battle.<\/span><\/p>\n

COLLABORATIVE POTENTIAL<\/b><\/p>\n

The MOU also opens up new opportunities for collaboration across the semiconductor value chain. Companies will need to work together at various stages of production to meet the growing demand for packaging technologies tailored to AI and HPC chips.<\/span><\/p>\n

The trade ministry\u2019s emphasis on public-private partnerships and its efforts to foster collaboration within the semiconductor industry is crucial to South Korea\u2019s success. By leveraging government support, more businesses will be able to access the funding and expertise needed to overcome the challenges of entering the advanced packaging market.<\/span><\/p>\n

Smaller firms, in particular, stand to benefit from partnerships with fabless companies and materials suppliers. By partnering with fabless companies or larger manufacturers, they can pool resources and expertise to overcome challenges small businesses usually face in accessing R&D.<\/span><\/p>\n

For fabless companies, collaboration with packaging firms is equally critical. These companies, which specialize in designing semiconductors but outsource their production, rely on advanced packaging technologies to ensure that their chips meet the performance standards required by modern AI and HPC applications.<\/span><\/p>\n

By partnering with packaging firms, fabless companies can access the latest technological advancements in chiplet packaging and 3D stacking, both of which are essential for improving chip performance and ensuring efficient power usage.<\/span><\/p>\n

UNCERTAIN OUTLOOK<\/b><\/p>\n

South Korea faces several challenges as it pushes to expand its presence in advanced semiconductor packaging. The ability of the country\u2019s semiconductor industry to adapt will depend on how effectively it can build collaborative networks across the value chain and reduce its vulnerability to external supply chain disruptions.<\/span><\/p>\n

Moreover, while the government\u2019s R&D investments and support for public-private partnerships create a solid foundation for growth, the long-term viability of these efforts is not guaranteed.\u00a0<\/span><\/p>\n

While the South Korean government may have positively contributed to the sector\u2019s success, it remains to be seen if local firms can overcome their industry\u2019s long-established structural challenges.<\/span><\/p>\n

Edited by Alannah Hill<\/span><\/i><\/p>\n

Business & Economy<\/span><\/a>Technology & Cyber<\/span><\/a><\/div>","protected":false},"excerpt":{"rendered":"

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